Samsung, Broadcom sign MOU to boost AI memory and foundry partnership

Samsung Electronics and Broadcom person signed a memorandum of knowing (MOU) to deepen their practice successful representation and foundry technologies.

The concern is expected to encompass projects valued astatine much than $200bn implicit the adjacent 5 years, done 2030.

The statement was announced astatine the AI Summit held astatine The Midway successful San Francisco, attended by executives from some companies and representatives of the South Korean government.

The collaboration aims to accelerate improvement and proviso of semiconductor solutions required for next-generation AI infrastructure.

Samsung co-CEO and instrumentality solutions (DS) part vice president Young Hyun Jun said: "AI is driving unprecedented request for tightly integrated semiconductor technologies spanning memory, logic and precocious packaging.

"By expanding our collaboration with Broadcom crossed these captious technologies, we look guardant to delivering greater worth to customers portion advancing the AI infrastructure of the future."

In representation technologies, Samsung and Broadcom mean to enactment intimately connected the proviso of precocious bandwidth representation (HBM) for the latter's aboriginal AI accelerators.

For foundry operations, the companies' plans absorption connected utilising Samsung's process technologies of 2nm and beneath for Broadcom's products, including Wireless Broadband Communications (WBC) solutions.

The concern whitethorn besides widen to precocious packaging techniques utilizing Samsung's 2nm process, specified arsenic 2.3D and 2.5D integration, which tin heighten show and vigor ratio successful AI and networking chips.

Broadcom semiconductor solutions radical president Charlie Kawwas said: "As AI infrastructure continues to scale, adjacent collaboration crossed the semiconductor ecosystem becomes progressively important.

"By combining Samsung's representation and foundry expertise with Broadcom's AI and connectivity leadership, we purpose to proceed to present technologies that powerfulness the adjacent procreation of AI infrastructure."

According to the companies, Samsung's capabilities spanning memory, foundry, logic, and precocious packaging are expected to enactment a wide scope of AI and high-performance computing applications arsenic portion of this expanded cooperation.

Recently, Samsung Electronics established a Robotics eXperience (RX) Business Office arsenic portion of its strategy to presumption robotics astatine the centre of its aboriginal concern plans. The caller part volition beryllium based astatine the company's probe and improvement field successful Seoul, South Korea, and volition study straight to co-CEO Roh Tae-moon.

"Samsung, Broadcom motion MOU to boost AI representation and foundry partnership" was primitively created and published by Verdict, a GlobalData owned brand.